Soldering process with minimal thermal impact on substrate
US5996222A · kind A · utility
19Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | May 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A soldering process is suitable for use with low cost, low heat distortion temperature thermoplastic substrates without distortion or damage to the substrate yet having the mass production capability exhibited by wave and reflow soldering techniques. The process allows integration of consumer products and, in particular, vehicle components such as integrated instrument panel or other such assemblies, without the redundancy of separate printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.