Solder paste screen printing apparatus and solder paste screen printing method
US5996487A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a solder paste screen printing apparatus and a solder paste screen printing method, in which a force of pressing of a squeegee can be adjusted delicately and accurately so as to effect the printing of solder paste with the optimum pressing force. A squeegee is connected to a lower end of a rod of a cylinder, and a load cell is provided above the rod. A first pressure and a second pressure are applied respectively to an upper chamber and a lower chamber of the cylinder. A load, applied to the load cell, is measured while varying the level of the first pressure, and the pressure measurement for the pressing force is effected in accordance with the measured load. In accordance with this result, the instruction pressure for the cylinder, which is necessary for obtaining the optimum pressing force, is determined, and then the printing of solder paste onto a substrate is started with this instruction pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.