Polishing apparatus with improved alignment of polishing plates
US5997390A · kind A · utility
8Cited by
11References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Feb 2, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B45/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a polishing machine for simultaneous double-sided polishing of workpieces between upper and lower polish tables, the upper polish table has a hollow center telescopically receiving in a drive hub supported from below. The drive hub is slotted and the upper polish plate has drive latches received in the slots. Lateral dislocations of the upper polish plate with respect to the drive hub are limited by providing stops on the drive latches which engage the outer surface of the drive hub. Additionally, the upper polish plate is suspended by a lifting rod from a double-ended main lifting cylinder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.