Microlens array and method of forming same and solid-state image pickup device and method of manufacturing same
US5997756A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1999 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Jan 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
A resist having a three-dimensional shape of a microlens array and a material layer of the microlens array are simultaneously etched under a condition by which planar patterns transferred from the resist to the material layer are larger than planar patterns of the resist. The spacing between microlenses can be made narrower than the spacing between the planar patterns of the resist. Even when the planar shape of the microlens is an ellipse, the curvatures can be optimized in both the row and column directions by making the heights in these directions different from each other. It is possible to provide a microlens array having a small non-focusing region and a solid-state image pickup device having a high sensitivity and little smear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.