Method for bonding rigid substrates
US5997786A · kind A · utility
20Cited by
17References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Apr 1, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0097
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Rigid substrates containing an adhesive composition on at least one surface are prepared by an injection molding operation. The degree of bonding between the adhesive layer and the substrate is greater than can be achieved using conventional methods for coating substrates with adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.