Method of producing sintered silicon nitride
US5998319A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Jun 10, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B35/584
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
By providing a new method of producing sintered silicon nitride, this invention takes into account the fact that parts made of Si.sub.3 N.sub.4 are often used in temperature ranges below 1200.degree. C. and sometimes even below 500.degree. C. and therefore needn't be designed to withstand temperatures above 1200.degree. C. The sintered silicon nitride for these low-temperature applications is obtained by sintering silicon nitride powder of <2 .mu.m with 5 to 20 wt. % of one or more glass components of the same particle size at temperatures below 1400.degree. C. It is a prerequisite that the glass components used, preferably alkali metal borate glasses with a coefficient of thermal expansion .alpha. which matches that of Si.sub.3 N.sub.4, have a transformation point T.sub.g which is below 750.degree. C., and that the individual glass components have a free enthalpy .DELTA.G which is at least 60% of the free enthalpy of SiO.sub.2. For low-temperature applications, Si.sub.3 N.sub.4 parts manufactured cost-effectively in this way fully satisfy the demands made on them in respect of density, strength and .beta.-phase proportion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.