Surface acoustic wave devices and their manufacturing method
US5998907A · kind A · utility
54Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02921
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.