Physically separating printed circuit boards with a resilient, conductive contact
US5999414A · kind A · utility
15Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1997 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Mar 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.