Method of making coaxial transmission lines on a printed circuit board
US6000120A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Apr 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a coaxial transmission line on a high density PCB. A metal strip (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.