Method and apparatus for placing conductive preforms
US6000602A · kind A · utility
Inventor
Key dates
| Filing date | Jan 28, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jan 28, 2017 |
Classification
- Technology area (CPC —)General
Abstract
A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.