System for calibrating wafer edge-grinder
US6000998A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer edge grinding machine including a chuck rotatable about a first axis, a chuck basin having bottom and side walls surrounding the chuck and a fine aligner disposed over an open top of the basin and configured to deliver wafers to the chuck. The machine further includes a probe having a sensor contact surface and a shifting mechanism adapted to selectively withdraw the sensor contact surface to a storage position and extend the contact surface to a measurement position. The probe also includes a mounting structure adapted to secure the probe to one of the walls in the basin with the probe being mounted in the basis to position the contact surface adjacent the perimeter of a wafer disposed on the chuck. The shifting mechanism includes a remotely operable control adapted to allow a user to operate the shifting mechanism from a location remote from the basin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.