Apparatus and method for chemical mechanical polishing of a wafer
US6001001A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jun 9, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a polishing configuration wherein a polishing material or slurry is applied to a surface of a rotating polishing pad and a product material mounted on a rotating carrier is moved into contact with the polishing material or slurry, the flow of the polishing material or slurry over the surface can be improved by fabricating spiral grooves or channels in the surface of the polishing pad and by mounting the product material is a cavity of the carrier, the cavity having grooves or channels in the side walls to provide a uniform flow over the product material. The angle between the spiral grooves or channels on the polishing pad and a diameter about the axis of rotation should be approximately 40.degree.. The spiral grooves or channels on the polishing pad can be combined with concentric grooves or channels to further improve the flow of polishing material. Similarly, the grooves or channels in the rotating carrier provide further uniformity for the interaction of the polishing material and the product material. As with the grooves or channels in the polishing pad, the grooves or channels in the side walls of the carrier cavity have an optimum angle of 40.degree. with respect to the d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.