Method and apparatus for applying uniform layers of adhesive to contoured surfaces of a substrate
US6001178A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 13, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | May 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for applying uniform layers of adhesive to contoured surfaces of a substrate comprises, in one embodiment, a die head mounted to an adhesive dispenser and having contoured first and second die faces offset relative to each other. One of the die faces is operable to contact the contoured surface of the substrate, and a contoured slot outlet in fluid communication with the adhesive dispenser is disposed between the die faces for applying adhesive material to the contoured surface of the substrate. In another embodiment of the invention for simultaneously applying adhesive to multiple non-coplanar surfaces of a substrate, the die head comprises multiple non-coplanar die faces, each having first and second die face portions offset relative to each other. One of the die face portions of each multiple die face is operable to contact a respective non-coplanar surface of the substrate. A slot outlet communicates with each of the multiple die faces for applying adhesive material to each of the multiple surfaces of the substrate. In yet another embodiment of the invention for applying adhesive material to flexible members of a substrate, a die head comprises first and second die fa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.