Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
US6001196A · kind A · utility
7Cited by
14References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1996 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Oct 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.