Lead frame supplying method
US6001670A · kind A · utility
3Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.