Silicone gel composition and silicone gel for use in sealing and filling of electrical and electronic parts
US6001943A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jan 28, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.