Hidden surface laser shock processing
US6002102A · kind A · utility
16Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Feb 25, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/356
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention includes a laser processing method for processing a hidden surface of a workpiece, the hidden surface disposed within a recess having an opening. The method comprises inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.