Method of using infrared radiation for assembling a first component with a second component
US6002110A · kind A · utility
7Cited by
22References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Aug 28, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/703
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of assembling a first component for assembly with a second component involves a heating device which includes an enclosure having a cavity for inserting a first component. An array of infrared energy generators is disposed within the enclosure. At least a portion of the first component is inserted into the cavity, exposed to infrared energy and thereby heated to a temperature wherein the portion of the first component is sufficiently softened and/or expanded for assembly with a second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.