Structure of resin molded type semiconductor device with embedded thermal dissipator
US6002181A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1995 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.