Multi-substrate radio-frequency circuit
US6002375A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Sep 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio-frequency circuit (20) includes a hybrid integrated circuit (24) having a passive circuit element (38) and a d-c biasing circuit element (54) embedded within a first substrate (32) of a low cost and rugged first semiconducting material, and first and second active circuit elements (36, 40) embedded within second and third substrates (44, 46), respectively, of a second semiconductor material having the characterisitics of greater frangibility but higher gain than the first semiconductor material. The first and second activ circuit elements (36, 40) are substantially first and second single components (36, 40), and are each electrically coupled to the passive circuit element (38). The d-c biasing circuit element (54) is electrically coupled to the first and second active circuit elements (36, 40). The second and third substrates (44, 46) are physically coupled to the first substrate (32), which is thicker than either the second or third substrate (44, 46).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.