Integrated circuit package for coupling to a printed circuit board
US6002589A · kind A · utility
86Cited by
35References
71Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jul 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.