Patent · US Expired

Structural dimple panel

US6004652A · kind A · utility

43Cited by
6References
28Claims
0Family size

Inventor

Key dates

Filing dateSep 13, 1996
Grant dateDec 21, 1999
Priority date
Expiry dateSep 13, 2016

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24661
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A panel having one or more dimple layers connected together by one or more reinforcing layers engaging ends of dimples on the dimple layer to create a cavity between the layers. The connection of the dimple layer and reinforcing layers creates an integral structural panel that can be planar by having identical heights of the dimples on the dimple layer to create a planar panel (flat) or nonplanar (curved) by varying the heights of the dimples on the dimple layer or through planar spacing adjustment. The panel can be modified in various ways such as by choice of materials and/or geometries of the various layers and/or incorporation of additional structural features.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.