Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound
US6005064A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1998 |
| Grant date | Dec 21, 1999 |
| Priority date | — |
| Expiry date | Jul 6, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel thermosetting compound which is speedily curable, generates no by-products during curing and gives cured products having excellent heat resistance and inflammability. A thermosetting compound characterized in containing, per molecule, at least one structural unit represented by the formula (A) and at least one structural unit represented by the formula (B) in a (A)/(B) molar ratio of 1/0.25 to 1/9, said structural units being bonded directly or via at least one organic group with one another; ##STR1## wherein R.sup.1 is a methyl group, a cyclohexyl group, a nonsubstituted phenyl group or a phenyl group substituted with at least one substituent, and each hydrogen atom on the aromatic rings of (A) and (B), except for one of hydrogen atoms on ortho-positions of the hydroxy group in the aromatic ring of (A), may optionally be replaced with a substituent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.