Method for making a set of embossing dies
US6007754A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method by which to easily and inexpensively make a matched set of male and female embossing dies so that articles can be embossed in an arts and crafts environment. Upper and lower sheets of adhesive are applied to opposite faces of a substrate, and each adhesive layer is covered with a paper backing to form a sandwich with the substrate secured between the upper and lower sheets. A design to be embossed is then cut through the sandwich. A portion of the backing covering the upper adhesive sheet is removed to expose an area of the adhesive, and a first die plate is bonded to the upper sheet. A different portion of the backing covering the lower adhesive sheet is removed to expose an area of the adhesive, and a second die plate is bonded to the lower sheet. The first and second die plates are pulled away from one another with a first part of the design cut through the sandwich affixed to the first die plate to form a male die half and the remaining part of the design cut through the sandwich affixed to the second die plate to form a female die half.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.