Absorption tailored laser sintering
US6007764A · kind A · utility
28Cited by
16References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Mar 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is a method which customizes the penetration depth of a heat-fusible powder used in solid freeform fabrication process such as laser sintering. The penetration depth of the heat-fusible powder is customized by combining opaque and transparent powders at a ratio which ensures that the beam contacts a portion of powder beneath its surface, thereby promoting complete layer sintering as well as adherence to previously sintered layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.