Method of forming a three-dimensional integrated inductor
US6008102A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Apr 9, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposited, and first and second trenches (410) are formed therein and filled with electroplated metal (412). A third photoresist layer (416) is deposited and a trench (418) formed therein, and then filled with electroplated metal (420). The first, second, and third photoresist layers (406, 408, 416) are then removed to expose a multi-loop inductor coil (500, 550).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.