Patent · US Expired

Low profile electrical distribution center and method of making a bus subassembly therefor

US6008982A · kind A · utility

39Cited by
22References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 20, 1998
Grant dateDec 28, 1999
Priority date
Expiry dateMay 20, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/063
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A low profile electrical distribution center comprises a plurality of thin bus assemblies that are stacked one upon another. Each bus assembly comprises stamped metal circuit components having planar bus portions sandwiched between thin flexible upper and lower sheets of insulation material that are bonded together. The stamped metal circuit components have male blade terminals that extend up or down from the bus portions. The thin flexible sheets of insulation material are die cut to facilitate manufacture and assembly of the stamped metal circuit components from a one piece stamped metal blank.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.