Electronic circuitry
US6008987A · kind A · utility
37Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit in which a heat pipe is mounted on a substrate for transporting heat from one region to another, the heat pipe also being secured to the substrate at a plurality of positions along the heat pipe for the purpose of increasing the stiffness of the substrate. The heat pipe may extend across a surface of the substrate or around an edge of the substrate. Heat conductive paths from the heat source may be provided by a ground plane within the substrate or a heat conductor may extend from the heat source to the heat pipe at a position spaced from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.