Reflow soldering method
US6010061A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Mar 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0475
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit card) that includes solder. The soldering surface and solder are heated in an oven to melt the solder. While the solder is liquids, the nonvertically approaching lead is mated with the soldering surface as it is inserted into the solder. The soldering surface, solder, and nonvertically approaching lead are then cooled, and the solder solidifies to conductively mount the nonvertically approaching lead to the soldering surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.