Resist compositions for plating
US6010823A · kind A · utility
4Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1997 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Mar 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/184
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25.degree. C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.