Method and an arrangement for mounting a component on a carrier
US6010920A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1997 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Nov 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.