Patent · US Expired

Oxidation-stabilized polyamide molding materials

US6011099A · kind A · utility

0Cited by

4References

8Claims

0Family size

Assignee

BASF SE

Inventors

Stefan Grutke · Neustadt, DE
Peter Comba · Heidelberg, DE
Charis Katsichtis · Heidelberg, DE

Key dates

Filing date	Oct 15, 1998
Grant date	Jan 4, 2000
Priority date	—
Expiry date	Oct 15, 2018

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K5/50
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A thermoplastic molding material comprising a mixture of a polyamide and a stabilizing amount of a copper compound obtained by reacting a copper(I) salt with a phosphine chelate ligand containing at least 2 phosphorous atoms.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.