Curable resin composition and cured products
US6011123A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.