Polyorganosiloxazanes and process for the preparation thereof
US6011167A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyorganosiloxazane is provided which is capable of being converted into a ceramic material having low dielectric constant. The polymer according to the present invention is characterized by comprising the main repeating units of --(RSiN.sub.3)--, --(RSiN.sub.2 O)--, --(RSiNO.sub.2)-- and --(RSiO.sub.3)--, wherein, R represents an alkyl, alkenyl, cycloalkyl, aryl, alkylamino or alkylsilyl group, and by having a number-average molecular weight ranging from 300 to 100,000. The polyorganosiloxazane of the present invention has superior thermal resistance, and a ceramic material obtainable by firing the same at a predetermined temperature shows very low specific dielectric constant of 2.7 or less, making it useful particularly as a material in electronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.