Film carrier and semiconductor device using the same
US6011310A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1996 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Sep 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.