PC card with thermal management
US6011690A · kind A · utility
18Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1997 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Jun 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0269
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PC card comprising a housing including top and bottom cover panels encloses at least one heat-generating circuit component, typically an IC device or package. A heat spreading element, which may be in the form of a copper sheet, is disposed in conduction heat transfer relationship with the at least one circuit component and at least one of the housing covers, the heat spreading element being adapted to receive heat from the at least one circuit component, to spread the heat uniformly and to transfer it to the at least one housing cover panel. From there, the heat is dissipated into the surrounding environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.