Precision polishing apparatus with detecting means
US6012966A · kind A · utility
77Cited by
2References
59Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | May 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out as products out of an unloading unit. The defective articles are classified in a discriminating device in conformity with the kinds of the defects thereof, and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.