Sharpening apparatus
US6012971A · kind A · utility
62Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1998 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Mar 13, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive material contains abrasive particles in the range of 50 to 80% by weight in an olefinic thermalplastic resin system which is based on ethylene copolymer. The material may be incorporated on a substrate structure to be used as a stropping or honing material or may be shaped by an injection molding process or may be injection molded over a rigid insert or molded over a rigid wheel or disk inserted in the mold. The material may be used for polishing and finishing of crystalline materials, ceramics, silicon and semi-conductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.