Transient voltage protection device with ceramic substrate
US6013358A · kind A · utility
38Cited by
31References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24992
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A transient voltage protection device is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection includes specific ceramic materials having a density of less than 3.8 gm/cm.sup.3 designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.