Microelectronic assembly including columnar interconnections and method for forming same
US6013571A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Jun 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly (10) is formed and includes an integrated circuit component (12) attached to a substrate (14). The integrated circuit component (12) includes metallic columns (24) formed on bond pads (16) on the component (12). A solder plate (30) is formed on each of the metallic columns (24). The integrated circuit component (12) is superposed onto a substrate (14). The substrate (14) includes substrate bond pads (32), and each metallic column (24) registers with a corresponding substrate bond pad (32) such that the solder plate (30) contacts the substrate bond pad (32) to form a preassembly. The preassembly is then heated to reflow the solder plate (30) to form a solder joint (34) between the integrated circuit component (12) and the substrate (14). The solder joint (34) is formed between the solder attachment surface (28) of the metallic column (24) and the substrate bond pad (32).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.