Piezoelectric thin-film device process for manufacturing the same, and ink-jet recording head using the same
US6013970A · kind A · utility
33Cited by
6References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 6, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Mar 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/8554
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A piezoelectric thin-film device includes: a substrate and a piezoelectric thin film formed on the substrate, wherein a thickness of the piezoelectric thin film is 1 to 10 .mu.m, a crystal grain size of the piezoelectric thin film is 0.05 to 1 .mu.m, and a surface roughness (Rmax) of the piezoelectric thin film is no more than 1 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.