Method of optically inspecting multi-layered electronic parts and the like with fluorescent scattering top layer discrimination and apparatus therefor
US6014209A · kind A · utility
25Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Jun 23, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A novel optical inspection technique for multi-layer wafers and the like in which conductor patterns of a top layer only are to be inspected, such layer being upon an intermediate transparent or translucent insulation layer in turn upon a base layer(s) thereunder, wherein the intermediate layer only is fluoresced, displaying the top layer conductors as dark in the field of fluorescent light, and causing reflections from layers below the intermediate layer effectively to disappear to obviate confusion with the top layer conductors to be inspected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.