High vertical aspect ratio thin film structures

US6015599A · kind A · utility

Assignee

• The Regents of the University of California · US

Inventors

• Christopher Guild Keller · Albany, US
• Mauro Ferrari · Beijing, CN

Key dates

• Filing date: Jun 6, 1995
• Grant date: Jan 18, 2000
• Expiry date: Jun 6, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24744
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.