Solder resist ink composition of a novolak-epoxy resin
US6015651A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1997 |
| Grant date | Jan 18, 2000 |
| Priority date | — |
| Expiry date | Apr 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.