Mounting apparatus for grid array packages
US6016254A · kind A · utility
Inventor
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | Jan 18, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.