Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor
US6017438A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1997 |
| Grant date | Jan 25, 2000 |
| Priority date | — |
| Expiry date | Sep 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.