Method for reinforcing structures
US6017588A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1998 |
| Grant date | Jan 25, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2018 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04G2023/0251
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a method for reinforcing a structure comprising the steps of forming a primer layer on the surface of a structure to be reinforced; forming if necessary a putty layer on the primer layer; applying an impregnating resin on the formed primer layer provided that the putty layer in case where the putty layer is formed on the primer layer, before, after or before and after cladding with the fiber sheets, to allow the resin to penetrate into the spaces in the fiber sheets; and curing the resin, PA1 the said primer, putty and impregnating resin comprising a resin composition which can cure at a temperature not more than 5.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.