Constant impedance air baffle for cooling of electronic card assemblies
US6018458A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1998 |
| Grant date | Jan 25, 2000 |
| Priority date | — |
| Expiry date | Apr 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A constant impedance air baffle assembly having two spaced apart generally parallel plates, each having a plurality of through holes for placing in line with a plurality of circuit cards to be cooled. The circuit cards are mounted on one side of a printed circuit board, and arranged in varying numbers and placements, depending on the number of cards desired. The air baffles provide a constant impedance to the air flow over the cards such that air does not bypass other components that need to be cooled when the circuit cards are removed. Further, the baffle plates include hanger tabs which may be hung over the edge of a printed circuit board to hold the parallel plates in place. The hanger tabs further include spacing slots for holding a pair of side-by-side printed circuit boards apart such that the printed circuit boards upon which said air baffle is hung cannot flex and short the pins on the backs thereof together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.