Optical semiconductor module and method for manufacturing same
US6019523A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
It is an object of the invention to provide a optical semiconductor module, which is resisting against external noise and can be easily fabricated. The optical semiconductor module comprises an optical wave-guiding medium allocated on a substrate, a photosensor for optical to electrical converting the optical signal emitted from an output end of the optical wave-guiding medium, means for optically coupling the output end of the optical wave-guiding medium with a light-receiving surface of the photosensor, insulating resin for filling space surrounding an output part of the optical wave-guiding medium and the photosensor, and conductive resin, which is applied to the insulating resin and communicates with a ground plane connected with a ground terminal of the photo sensor. Insulting resin is composed of the first resin, which has a refractive index being the same as that of core of the optical wave-guiding medium, and fills a space between the output end of the wave-guiding medium and the light receiving surface of the photosensor, and the second resign, which is sealing resin for enclosing the first resin. Means for optically coupling is constituted of a mirror, which directs a lig…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.