Semiconductor devices with CSP packages and method for making them

US6020217A · kind A · utility

Assignee

• Daimler-Benz AG · DE

Inventors

• Max Kuisl · Ulm, DE
• Karl Strohm · Ulm, DE
• Manfred R.o slashed.sler · Ulm, DE

Key dates

• Filing date: Feb 20, 1998
• Grant date: Feb 1, 2000
• Expiry date: Feb 20, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a semiconductor device which includes a packaged electrical component such as an IC chip, wherein terminal posts are realized within the chip area without additional wafer surface being required beyond the chip edge. A direct feedthrough of the individual electrical connections by way of downwardly extending terminal posts that are connected to bonding pads at the top of the chip results in a small lead length and thus lesser parasitic influences, which in turn results in optimum conditions for use at super-high frequencies. Furthermore, a process for making the semiconductor device offers the option of forming deep vertical trenches on the chip edge and to thus implement separation etching for dicing. During this process, the coverage of the side surface with encapsulating material effects a passivation on the chip edge without further outlay. Expensive rewiring of the connections on the bottom side of the chip is not necessarily due to the terminal posts.